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U.S. semiconductor manufacturer GlobalFoundries [GF] last Friday said it will establish a new center to package and test U.S. made chips through a trusted end-to-end process in support of national security. The New York Advanced Packaging and Photonics Center in Malta, N.Y., will benefit from up to $75 million in direct U.S. funding under the CHIPS and Science Act that was also announced on Jan. 17, and $20 million from New York state, which previously provided $550 million to the…
