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The Defense Innovation Unit (DIU) on Monday released a solicitation for a digital engineering platform that would accelerate the design and validation of analog, mixed-signal, photonic, and hybrid chips. The design of these chips is a lengthy process, making it a bottleneck in the supply, DIU said. Additional challenges include design processes that are manual, slow, and “error-prone,” high prototyping costs, and a shortage of skilled designers, all of which create “bottlenecks in the development pipeline,” it added. DIU said…
