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The Biden Administration on Wednesday said it has reached preliminary terms to provide $400 million to two U.S.-based subsidiaries of Taiwan’s GlobalWafers Co. as part of efforts to onshore semiconductor manufacturing, including adding a new facility in Missouri to produce wafers that are common in aerospace and defense applications. The investment under the CHIPS and Science Act for a new facility in St. Peters, Mo., will be for production of 300mm silicon-on-insulator (SOI) wafers, which “allow for significantly improved performance…
