ORLANDO, Fla., May 5, 2020 /PRNewswire-PRWeb/ — Micross Components, Inc. (“Micross”), a leading global provider of mission-critical microelectronic components and services for high-reliability markets announces further progress in its strategic integration with Corfin Industries, LLC (“Corfin”), an industry-recognized leader in proprietary processes and technologies such as Robotic Hot Solder Dip (RHSD) Technology, innovative component preparation/modification solutions plus BGA Reballing/Deballing and trim & form services.

This combination brings together the in-depth market expertise of the two companies to further strengthen Micross’ “One Source One Solution” service offering. The Company is committed to provide an unparalleled array of high-reliability electronic product, packaging, test and modification services servicing the US, European and Global markets.

Vince Buffa, Chairman of Micross, said: “Our vision is that this compelling combination of high-performing businesses will create superior and differentiated value for both Micross and Corfin customers, fueling the next stage of the Company’s long-term growth.”

Richard Kingdon, President of Micross added: “We are excited to join forces with Corfin and leverage the complementary strengths of the two organizations to further enhance the Micross One Source One Solution service offering to our customers. We welcome our new colleagues in Manchester and Round Rock and look forward to working closely together.”

Donald Tyler, President of Corfin Industries, stated: “This integration with Micross demonstrates Corfin’s strategic commitment to broaden the portfolio of components and services we offer to our defense, commercial aerospace, space, industrial and healthcare sectors. We look forward to integrating our many years of expertise in component modification services to further strengthen Micross’ overall portfolio of customer offerings.”

Corfin Industries will continue operations at its Nadcap-certified component preparation & Robotic Hot Solder Dip facility in Manchester, New Hampshire and its BGA Reballing Center of Excellence and rework facility in Round Rock, TX (formerly eTech). Corfin’s facilities will now operate as Micross Manchester and Micross Round Rock, respectively. Micross Hatfield, PA facility has started transitioning its component modification business, including its proprietary lead-attach services, to Corfin facilities with estimated completion by Q4, 2020.

About Micross
Micross (http://www.micross.com) is the global one-source provider of mission-critical microelectronic components and services, including Bare Die & Wafers, Advanced Interconnect Technology, Custom Packaging & Assembly, Component Modification Services, Electrical & Environmental Testing and Hi-Rel Products to manufacturers and users of semiconductor devices. In business for more than 40 years, Micross’ extensive hi-reliability capabilities serve the Aerospace & Defense, Space, Medical and Industrial markets, among others. Micross possesses the sourcing, packaging, assembly, engineering, test and logistics expertise needed to support an application throughout its entire program cycle.

About Corfin Industries
Corfin Industries (http://www.corfin.com) performs a variety of component preparation services. With proprietary technology and processes, Corfin’s Robotic Hot Solder Dip (RHSD) process is proven to safely mitigate the risk of Tin Whiskers by robotically refinishing Pb-free COTS component terminations with tin-lead (SnPb). This process eliminates the tin whisker risk, restores solder joint reliability and refinishes components to reliable defense industry standards. In addition, Corfin offers gold mitigation services, BGA re-balling, trim and form services, re-conditioning of bent leads and lead-attachment to LCC packages.

SOURCE Micross Components